anti-reflective coatings and sublayers – barcs and siarcs, and socs – are used to boost the effectiveness of lithography by widening and improving the process and reflectivity windows: barcs reduce reflective light during the exposure step, improving the reflectivity control of the resist. they also...
uniform matte black appearance is desired. it offers thinner construction than pyralux® hxc, but similar mechanical and process properties. view details all-polyimide solutions all-polyimide solutions dupont adhesiveless all polyimide copper clad flexible laminates (ccl) are available in a wide variety of...
us contact us english 한국어 简体中文 繁體中文 日本語 close laminates fluoropolymer adhesive solutions overview products contact us home products printed circuit board materials laminates fluoropolymer adhesive solutions twitter linkedin email pyralux® fluoropolymer adhesive solutions dupont offers a family of...
leading-edge copper through silicon via (tsv) chemistries to the advanced packaging market. our production-proven, three-component copper solutions enable even the most challenging tsv aspect ratios due to: high purity copper gap-free performance during bottom-up fill fast plating speeds elimination of...
copper (cu) pillars offer a finer-pitch alternative to solder bumps to form interconnects between the chip and the package substrate, interposer, or other chips in d integration schemes. they are fabricated on top of under bump metallization (ubm) using photolithography and deposition processes and are...
support advanced patterning dupont designs microlithography materials to improve existing microlithography processes as well as support advanced patterning processes. our long history in lithography technology includes many industry-first enabling technology innovations. we lead the market in terms of...
reliability, the stack serves purposes: it forms the electrical connection between the die and the bump it serves as a barrier to eliminate unwanted diffusion it creates the mechanical connection between the bump and the bump pad our semiconductor packaging portfolio dupont delivers a full portfolio of...