& powder spray dried fruit & vegetables powder whole spices & ground oil seeds pastes/pickles/mango pulp raisin & peanut seasoning masala inquiry quality contact us wide range of products under one roof home about us products dehydrated red onion dehydrated white onion dehydrated garlic air dried vegetables...
overview products contact us home products semiconductor fabrication and packaging materials lithography materials and services ancillary lithography materials twitter linkedin email enhancement chemistries to support a total lithography solution dupont's roots run deep in its production-proven line of...
lithography process requirements dupont offers a robust, production-proven photoresist product line with materials options that meet the requirements across generations of lithography processes from nm down to . nm wavelengths, and exposures that achieve features from nm to nm. the quest to achieve...
advanced overcoat products decrease the occurrence of defects before or after wafer patterning. our unique formulations provide you with new solutions for today's patterning challenges, enabling you to reach critical dimensions that can't be achieved through conventional lithography processes alone....
our ekc technology portfolio. post-etch residue removers portfolio: plasmasolv® products - hda® technology plasmasolv® products are designed to remove post etch residue. these products perform at low operating temperatures, well below the flashpoint of the chemistry, providing a safe chemical process...
formulations including tin-silver alloys, pure tin, and indium materials meet a range of process temperatures and melting points, suiting both high- and low-temperature processing needs. designed to overcome our customers' most difficult challenges, such as voiding and throughput, solderontm products...
get best quote approx. rs / kgget latest price product details: style indian curry packing kg food grade evoh pouch taste basic vegetable curry taste ingrediants vegetables uses cooking purpose color red red curry paste made with onion, ginger, garlic, finely grind coriander and peppercorns with lots of...
acrylic-based adhesive systems that offer superior bond strength and flexibility in high volume applications. many standard and customized constructions of core dielectric, adhesive, and copper thicknesses are available to meet today's demanding design requirements requiring multiple high-temperature...
redistribution layers (rdls) are ideally suited to today's high-density requirements, enabling rdl patterns for fan-out wafer level packages to meet next-generation line/space requirements down to μm. our easy-to-use, high-purity copper electroplating chemistries are formulated to enhance reliability of...