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factors in device packaging and has a significant impact on product reliability. gtbf uses professional mold flow software for physical behavior analysis, which can predict filling behavior and filling lines. fill analysis wire shift thermal the thermal factor is the biggest factor in the failure of semiconductor...
procurement officer carla rachel h. king treasurer eugene eligio t. velasquez accounting and controller division heads marco q. salas plastics division victor f. ilustrismo jr. water treatment division jomar v. demetria chemicals division ethelwaldo s. lapiz agrochemicals division joel s. masilungan semiconductor...
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electronic parts and equipment federal supply classification (fsc) - communications security equipment and components - radio navigation equipment, except airborne - radio navigation equipment, airborne - resistors - capacitors - relays and solenoids - electron tubes and associated hardware - semiconductor...
safety support and high technology products help people lead safer and better lives and contribute to the success of many industries. our adhesives, sealants and coating materials are used in production of automobiles and electronic and digital devices, while our underfill adhesives protect the semiconductor...
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