Search Results for: Presses
career choices job description: ) breaks semiconductor wafers into individual dies, using equipment and handtools: places semiconductor wafer on pad, using tweezers. ) taps wafer, using pencil tip, awl, or tweezers to break wafer into quarters. ) places semiconductor wafer quarter on plastic square. ) presses
career choices job description: ) breaks semiconductor wafers into individual dies, using equipment and handtools: places semiconductor wafer on pad, using tweezers. ) taps wafer, using pencil tip, awl, or tweezers to break wafer into quarters. ) places semiconductor wafer quarter on plastic square. ) presses...
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