Search Results for: Electro thermo appliances
variable machines in modular format support a large range of technologies and, from the installation of just one machine through to assemblies of over 1,000, can take care of processes such as, cob (chip on board), sop (system on package), epoxy die attach, pop (package on package), 3d packaging, ts (thermo-sonic
) and tc (thermo-compression) processing, plasma rie surface cleaning, plasma icp etching, and thin wafer plasma dicing. to perform odd-form placement and end-of-line work, we also offer automated equipment. manufacturers require easily adaptable, modular and efficient solutions in order to remain competitive...
https://eu.industrial.panasonic.com/products/factory-automation/surface-mount-technology