Search Results for: Copper articles
inner layer cores. high density interconnect technology includes micro via, buried via, +n+ , open end flex finger & high volume rigid-flex. simultaneous via partitioningtm (svptm) custom manufacturing svptm technology is a patented pcb design that use a plating resist (pr) which selectively prevents copper
high aspect ratio, stacked vias sanmina specializes in hdi, as well as any-layer-vias, multi-level stacked vias, blind via formation and backdrilling, with ultra high board aspect ratios ( : ), over + layers, and in formats to inches. thermal management, coining, planar magnetics sanmina's heavy copper...
https://www.sanmina.com/contract-manufacturing-design/printed-circuit-boards/technology/