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uniform matte black appearance is desired. it offers thinner construction than pyralux® hxc, but similar mechanical and process properties. view details all-polyimide solutions all-polyimide solutions dupont adhesiveless all polyimide copper clad flexible laminates (ccl) are available in a wide variety of...
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leading-edge copper through silicon via (tsv) chemistries to the advanced packaging market. our production-proven, three-component copper solutions enable even the most challenging tsv aspect ratios due to: high purity copper gap-free performance during bottom-up fill fast plating speeds elimination of...
sanskrit word stupa . [ ] the stupa was originally a structure or other sacred building containing a relic of buddha or of a saint, [ ] then it was gradually stylized in various ways and its shape can change quite a bit according to the era and to the country where it is found. [ ] often offertory strips...
copper (cu) pillars offer a finer-pitch alternative to solder bumps to form interconnects between the chip and the package substrate, interposer, or other chips in d integration schemes. they are fabricated on top of under bump metallization (ubm) using photolithography and deposition processes and are...
support advanced patterning dupont designs microlithography materials to improve existing microlithography processes as well as support advanced patterning processes. our long history in lithography technology includes many industry-first enabling technology innovations. we lead the market in terms of...