Search Results for: Copper articles
first commercial use for sputtering deposition was in semiconductors and electronics for front end and back end packaging, diffusion barriers, compounds, phase change memory, ic interconnects, micro contacts, and in sensors, mems and leds. sputtering targets and evaporation materials composed of copper
and copper alloys, including copper-nickel and copper-chromium , as well as nickel and nickel alloys such as nickel-aluminum , nickel-vanadium , nickel-platinum , nickel-copper and nickel-chromium , are manufactured for packaging and other applications. additional materials include aluminum (both in...
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