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extra large board ( x mm) fine pitch components ( mils) micro bga, csp ( . mm), chips x-ray, aoi and digital microscope high melting point(hmp) soldering process conformal coating complies to aerospace std tcp acf bonding in-circuit test fixture & software development flying probe test software labview...
series of pyrotechnic events in a controlled energetic reaction. the massive electro-pyrotechnic initiator chip (mepic) resistor features a standard case geometry (smd) that enables the implementation of assembly processes commonly used in the electronic component industry (pick and place, reflow soldering...
series of pyrotechnic events in a controlled energetic reaction. the massive electro-pyrotechnic initiator chip (mepic) resistor features a standard case geometry (smd) that enables the implementation of assembly processes commonly used in the electronic component industry (pick and place, reflow soldering...
series of pyrotechnic events in a controlled energetic reaction. the massive electro-pyrotechnic initiator chip (mepic) resistor features a standard case geometry (smd) that enables the implementation of assembly processes commonly used in the electronic component industry (pick and place, reflow soldering...