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find a flux additional parameters osp pad finish is used pcb is reflowed before wave soldering pcb is > " ( mm)thick pcb has + copper layers wave solder contact time is > seconds selective soldering on main wave using pallet type carriers in circuit testing (ict) is done with pins transparent flux residues...
find a flux additional parameters osp pad finish is used pcb is reflowed before wave soldering pcb is > " ( mm)thick pcb has + copper layers wave solder contact time is > seconds selective soldering on main wave using pallet type carriers in circuit testing (ict) is done with pins transparent flux residues...
find a flux additional parameters osp pad finish is used pcb is reflowed before wave soldering pcb is > " ( mm)thick pcb has + copper layers wave solder contact time is > seconds selective soldering on main wave using pallet type carriers in circuit testing (ict) is done with pins transparent flux residues...
o perati onalguid e line s drought mitigating interventions for additional fodder production programme (afdp) under rkvy . background: crop residues contribute significantly to fodder availability also" any decline in area under various crops results in shortage of fodder causing severe hardship to livestock...