Search Results for: Paperboard printed for self recording apparatus
multi-chip packages publication number: abstract: disclosed herein are thermal assemblies for multi-chip packages (mcps), as well as related methods and devices. for example, in some embodiments, a thermal assembly for an mcp may include a heat pipe having a ring shape. type: application filed: august
, publication date: february , applicant: intel corporation inventors: zhimin wan, je-young chang, chia-pin chiu, shankar devasenathipathy, betsegaw kebede gebrehiwot, chandra mohan jha hybrid depth sensing pipeline publication number: abstract: an apparatus for a hybrid tracking and mapping is described...
https://patents.justia.com/company/intel