Search Results for: Soldering brazing apparatus
the latest pcba and surface mount (smt) capabilities including support for : components, fine pitch and high count bgas, package on package (pop), chip on board, fiber optics, rf microelectronics, press fit connectors hybrid processes (tin-lead and lead-free), pin through hole, wave & selective soldering
the latest pcba and surface mount (smt) capabilities including support for : components, fine pitch and high count bgas, package on package (pop), chip on board, fiber optics, rf microelectronics, press fit connectors hybrid processes (tin-lead and lead-free), pin through hole, wave & selective soldering...
https://www.sanmina.com/contract-manufacturing-design/pcb-assembly-smt/