Search Results for: Electric accumulator nickel cadmium
pcb process capability processing layers: - layers finished thickness: "~ " ( . mm ~ . mm) minimum aperture: mil ( . mm) minimum line width / spacing: - mil ( - . mm) maximum board size: single & double "x " ( x mm), multi-layer "x " ( mm x mm) impedance control: ± % surface treatment: osp, hasl, electric
nickel / gold, chemical nickel / gold, lead-free hasl , gold finger, immersion silver, immersion tin. base materials: fr ( shengyi, kb, international), high tg (tg , tg ), halogen-free board (halogen-free), high frequency plate (rogers, teflon, taconic), made ptfe (ptfe), al aluminum plate (berquist...
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