etching si drie for mems and tsv plasma dicing of si & iii-v (gaas/inp/gan) algan/gan etch for gan power device fabrication sic trench etch for sic power device fabrication sapphire & gan etch for hb leds depassivation for ic failure analysis photoresist removal/ashing surface treatment & other polymer...
etching si drie for mems and tsv plasma dicing of si & iii-v (gaas/inp/gan) algan/gan etch for gan power device fabrication sic trench etch for sic power device fabrication sapphire & gan etch for hb leds depassivation for ic failure analysis photoresist removal/ashing surface treatment & other polymer...
packing (carton) type: ap-yv detection range: . kv-± . kv appearance: gray shell gray button detection accuracy: ± % detection distance: mm± . mm input voltage: dc v( *aaa) working current: working temperature: °c→ °c net weight: g(includes: batteries) application: can be widely used in electronics, semiconductor...